A vacuum lamination machine is designed for high-precision, bubble-free bonding, making it ideal for the optoelectronics and electronics industries to align and laminate two substrates with great accuracy.

• Vacuum Lamination Technology:Utilizes vacuum to eliminate air bubbles, ensuring a smooth and flawless bonding surface.
• High-Precision Alignment:Equipped with a precision vision alignment system for accurate positioning, improving product yield.
• Automated Process:User-friendly interface supports automatic lamination, pressing, and unloading, enhancing productivity and process stability.
• Compatible with Various Materials:Supports lamination of optical adhesive (OCA), polarizers, glass, flexible circuits (FPC), and other materials.
• Pressure and Temperature Control:Includes adjustable pressure and temperature settings to ensure optimal bonding conditions for different materials.
• Modular Design:Customizable mechanical structure and functions to meet diverse customer requirements with high flexibility.